Chipmakers back ASML's high-NA EUV upgrade, eye 12-inch photomasks and 40% productivity uplift
TL;DR Summary
Samsung and TSMC plan to deploy ASML’s high-NA EUV machines in coming years, joining Intel in adopting the technology and pushing a shift from 6-inch to 12-inch photomasks that could lift chip-making productivity on these machines by about 40% while enabling smaller features for AI data centers and consumer devices.
- Top chipmakers embrace ASML’s $400M machines, agree to crucial chipmaking change Ars Technica
- ASML Wins Over Top Chipmakers for New EUV Machines Bloomberg.com
- Intel Just Hit a Key Milestone in Its Foundry Comeback Yahoo Finance
- TSMC, Samsung commit to ASML’s newest chipmaking tools as AI drives demand CNBC
- ASML to work with major chipmakers to use latest tools for larger chips Reuters
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