Chipmakers back ASML's high-NA EUV upgrade, eye 12-inch photomasks and 40% productivity uplift
Samsung and TSMC plan to deploy ASML’s high-NA EUV machines in coming years, joining Intel in adopting the technology and pushing a shift from 6-inch to 12-inch photomasks that could lift chip-making productivity on these machines by about 40% while enabling smaller features for AI data centers and consumer devices.