IBM Unveils 0.7 nm Nanostack Chip, Pushing Angstrom-Scale Computing

IBM announces the world’s first sub-1 nanometer chip at 0.7 nm built with a 3D nanostack transistor design, packing about 100 billion transistors in a fingernail-sized die and delivering up to 50% more performance or 70% greater energy efficiency than its 2 nm predecessor. The nanostack stacks transistors in 3D layers with material flexibility, shows 40% SRAM scaling, and points to production within five years, backed by partners and the launch of Anderon quantum-foundry; the work leverages High-NA EUV lithography and aims to push Angstrom-scale computing forward.