"Samsung Embraces SK Hynix Tech in AI Chip Race"

Samsung plans to adopt the mass reflow molded underfill (MUF) technique, favored by rival SK Hynix, for its high bandwidth memory (HBM) chip production in a bid to catch up in the AI chip race. The demand for HBM chips has surged with the rise of generative AI, and Samsung's decision to switch to MUF comes after facing production issues with its non-conductive film (NCF) technology. Despite Samsung's denial of using MUF, sources reveal that the company has issued purchase orders for MUF equipment and is in talks with material manufacturers. Samsung's HBM3 chip production yields currently lag behind SK Hynix, but the company aims to use both NCF and MUF techniques for its latest HBM chip.