SK Hynix targets Indiana as U.S. memory production hub by 2030
TL;DR Summary
SK Hynix breaks ground on a $4 billion Indiana packaging plant—the first U.S. facility for memory packaging—to position Indiana as a key source of high-bandwidth memory (HBM) by 2030, with chips manufactured in Asia and shipped to Indiana for packaging. The project is supported by CHIPS Act funds and state incentives, will create about 1,000 direct jobs plus thousands more in construction and partners, and is part of a broader U.S. expansion alongside ongoing capacity growth in Korea.
- SK Hynix CEO says Indiana will be key memory production base by 2030, first U.S. facility now underway CNBC
- SK hynix breaks ground on $4 billion advanced packaging production facility in Purdue Research Park Purdue University
- SK Hynix partners with Purdue University, ceremonially breaks ground on $4B memory chip facility WLFI
- SK hynix (SKHY) and Samsung Electronics: SK hynix Is Spending $720 Billion on Memory Chips. Its Stock Has Already Fallen 21% Yahoo Finance
- SK Hynix to start AI chip output in Indiana in 2029, sees memory shortage through 2030 Reuters
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