
AI Push Forces Apple Packaging Upgrade: A20 Pro Adopts WMCM for Bigger On‑Device AI
AI-driven demand is pushing Apple away from the older InFO-PoP packaging toward a Wafer-Level Multi-Chip Module (WMCM) for the A20 Pro, addressing thermal limits by separating DRAM from the die and boosting bandwidth to support larger on‑device AI workloads; rumors of LPDDR6 and other tweaks circulate, but details remain unconfirmed.












