
A20 Pro Leak Signals iPhone 18 Pro AI and Thermal Gains
A leaked image of Apple’s A20 Pro chip suggests the iPhone 18 Pro will use Wafer-Level Multi-Chip Module packaging with DRAM on the side to reduce heat buildup, paired with LPDDR6 memory and a larger NPU for AI performance. Supposedly built on a 2nm N2 process, this setup could yield notable speed and efficiency gains. The Pro and Fold models are rumored to share 12GB of RAM, 48MP cameras, and a C2 modem, with a September release target.
