Huawei bets on 'LogicFolding' to power fall Kirin chips amid sanctions
Huawei unveiled a new 'LogicFolding' approach to manufacture its Kirin smartphone chips this fall, aiming for 1.4-nm‑class capabilities by 2031 despite U.S. sanctions. The move comes as Nvidia faces export restrictions in China and Apple remains a key competitor, though experts caution that the method’s real-world scalability, heat management, and yields remain unproven at scale.