Xiaomi XRING 03: 3nm Powerhouse with LPDDR6 and All-Big-Core CPU
Xiaomi has introduced the XRING 03, built on TSMC’s 3nm N3P process with 24 billion transistors, featuring an all-big-core CPU design, a 16-core G2-Ultra NX GPU, and LPDDR6 RAM support at 10,667 Mbps (113.8 GB/s). The chip uses a larger 133 mm² die with 16 MB SLC cache, adds 432 MP imaging capability with H.266 hardware decoding, and Xiaomi plans a global rollout of XRING 03-powered devices such as the Xiaomi 18 Fold later this year.
