All articles tagged with #wmcm
Apple’s attempt to diversify memory suppliers for the iPhone 18 Pro is hampered by a WMCM packaging shift that locks the Pro line to Samsung and SK Hynix for now, sidelining CXMT and sealing a price increase for Pro models; the standard iPhone 18 could gain CXMT-backed relief next spring, but the broader memory squeeze remains a factor for buyers.
AI-driven demand is pushing Apple away from the older InFO-PoP packaging toward a Wafer-Level Multi-Chip Module (WMCM) for the A20 Pro, addressing thermal limits by separating DRAM from the die and boosting bandwidth to support larger on‑device AI workloads; rumors of LPDDR6 and other tweaks circulate, but details remain unconfirmed.
A leaked motherboard image suggests the iPhone 18 Pro will use Wafer-Level Multi-Chip Module (WMCM) packaging for the A20 Pro, relocating DRAM to the side to spread heat and reduce throttling while maintaining high speed. The A20 Pro is also said to feature LPDDR6 memory with a 96-bit bus and a substantially expanded Neural Engine, boosting bandwidth and on-device AI performance. The WMCM approach could enable more chiplet variants and lower production waste. The leak is tied to a hacked Tata iPhone factory, though the image’s provenance remains unconfirmed.
A leaked image of Apple’s A20 Pro chip suggests the iPhone 18 Pro will use Wafer-Level Multi-Chip Module packaging with DRAM on the side to reduce heat buildup, paired with LPDDR6 memory and a larger NPU for AI performance. Supposedly built on a 2nm N2 process, this setup could yield notable speed and efficiency gains. The Pro and Fold models are rumored to share 12GB of RAM, 48MP cameras, and a C2 modem, with a September release target.
Apple is reportedly adopting a Wafer-Level Multi-Chip Module (WMCM) to place the A20 Pro AP and DRAM side-by-side, reducing interconnects and chip thickness to improve heat dissipation in the 2nm iPhone 18 Pro lineup, complemented by a vapor-chamber cooling system and a stronger Neural Processing Unit for better on-device AI.
Rumors suggest that Apple's A20 chip, likely to be exclusive to the iPhone 18 Pro, iPhone 18 Pro Max, and foldable iPhone 18 Fold, will be manufactured using TSMC's advanced 2nm process with WMCM packaging, offering improved performance and power efficiency. The new chip is expected to be 15% faster than the A19, with no increase in RAM, and production will begin in late 2026. It remains unclear if lower-end models will also feature WMCM packaging.