SK hynix Expects Memory Shortage to Persist Through 2030

SK hynix CEO Kwak Noh-Jung says the memory shortage could last through 2030 as AI-driven demand shifts DRAM and HBM into more customized configurations, reducing the likelihood of a sharp oversupply. The Indiana facility will handle packaging and testing only; wafers will be produced in South Korea and shipped to the US for HBM4E packaging, with cleanroom operations starting in 2028 and volume production targeted for 2029. As a result, DRAM and NAND prices are not expected to ease meaningfully for consumers well into the next decade.