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"Intel's Next-Gen Lunar Lake Chip: 3X NPU Uplift and On-Package Memory for Mobile CPUs"

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Source: AnandTech
"Intel's Next-Gen Lunar Lake Chip: 3X NPU Uplift and On-Package Memory for Mobile CPUs"
Photo: AnandTech
TL;DR

During Intel's CES keynote, EVP Michelle Johnston Holthaus briefly showcased a finished Lunar Lake chip, hinting at the upcoming next-gen mobile CPU's use of on-package memory, a first for Intel's Core chips. The chip features two DRAM packages, promising significant IPC improvements for the CPU core and three-times the AI performance for the GPU and NPU. While specific details on Lunar Lake remain scarce, Intel aims to launch it in 2024, demonstrating ongoing progress and innovation in the realm of mobile computing.

Topics:technology#ces#cpus#intel#lunar-lake#on-package-memory#technology
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  1. CES 2024: Intel Briefly Shows Lunar Lake Chip; Next-Gen Mobile CPU Uses On-Package Memory  AnandTech
  2. Intel's Arrow Lake and Lunar Lake CPUs will arrive in 2024 - three times more AI performance for both GPU and NPU  Tom's Hardware
  3. Intel Arrow Lake Gaming CPUs With AI Accelerators Coming This Fall, Next-Gen Lunar Lake Brings Significant IPC & Over 3X NPU Uplifts  Wccftech

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