Huawei Bets on 1.4nm Chips to Narrow Gap With TSMC
Huawei says it has a new pathway, dubbed LogicFolding, to shrink its gap with leader TSMC by aiming to mass-produce 1.4‑nanometer chips by 2031, a move that could challenge the need for ASML’s advanced EUV equipment since TSMC has said it will mass-produce 1.4nm by 2028. If Huawei can scale this, it would mark a significant step in China’s push for semiconductor self-sufficiency and shorten the industry lead held by TSMC, though the plan hinges on large‑scale manufacturing capabilities and technological breakthroughs.