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Logicfolding

All articles tagged with #logicfolding

Huawei Unveils Tau Scaling Law to Accelerate Transistors and System Performance
technology1 hour ago

Huawei Unveils Tau Scaling Law to Accelerate Transistors and System Performance

At the 2026 IEEE ISCAS, Huawei’s He Tingbo introduced the Tau (τ) Scaling Law, a time-based alternative to traditional geometric scaling for semiconductors and electronic systems. The approach uses LogicFolding and a multi-level, software–hardware co-design to shorten the signal time constant and boost transistor density, circuit performance, and energy efficiency across devices, circuits, chips, and systems. Huawei says it has designed 381 τ-based chips, with Kirin models slated to adopt LogicFolding in Fall 2026, and envisions future high-end chips reaching ~14 Å density by 2031, while calling for open collaboration across the industry.

Huawei Bets on 1.4nm Chips to Narrow Gap With TSMC
technology3 hours ago

Huawei Bets on 1.4nm Chips to Narrow Gap With TSMC

Huawei says it has a new pathway, dubbed LogicFolding, to shrink its gap with leader TSMC by aiming to mass-produce 1.4‑nanometer chips by 2031, a move that could challenge the need for ASML’s advanced EUV equipment since TSMC has said it will mass-produce 1.4nm by 2028. If Huawei can scale this, it would mark a significant step in China’s push for semiconductor self-sufficiency and shorten the industry lead held by TSMC, though the plan hinges on large‑scale manufacturing capabilities and technological breakthroughs.