Snapdragon 8 Elite Gen 6: Same Die, Higher Price Driven by 2nm Tech
Qualcomm’s standard Snapdragon 8 Elite Gen 6 is expected to reuse the 126.2 mm² die size of Gen 5 to curb costs, but a switch to TSMC’s 2nm process is anticipated to push prices higher for device makers. The Pro version, meanwhile, is rumored to gain a larger L2 cache and a wider GPU bus, further differentiating the lineup amid Qualcomm’s ongoing handset-market challenges.