All articles tagged with #2nm process
A Fixed Focus Digital leak claims the foldable iPhone Ultra will have very limited supply at launch, while the iPhone 18 Pro will use the A20 Pro chip built on TSMC’s 2nm process, delivering up to 18% faster performance and up to 30% better efficiency than the iPhone 17 Pro’s A19 Pro, with Apple’s event reportedly just weeks away.
Google's Pixel 11 uses a Tensor G6 built on a 2nm process, offering 256GB base storage and 12GB RAM. Preorders on Amazon are $899 — $100 off the list price — and include a $100 gift card plus an extra 10% off. The phone launches Aug 20, with 7 years of security updates, and no charger included. 128GB options are retired; colors include Frost, Pistachio, Hibiscus, and Obsidian.
Analyst Jeff Pu predicts the iPhone Air 2 will debut in Q1 2027 alongside the iPhone 18/18e, featuring a second 48‑megapixel Ultra Wide camera, a smaller Dynamic Island, a 2nm A20 Pro chip, a second‑gen N2 wireless chip, and a second‑gen C2 5G modem, plus a 6.5-inch display, 12GB RAM, and an 18MP front camera.
Rumor has it Apple’s iPhone 18 Pro and Ultra will ship with the A20 Pro chip built on TSMC’s 2-nanometer process, delivering more power and efficiency. A second upgrade comes via Wafer-Level Multi-Chip Module packaging, bringing memory closer to the SoC for better AI performance and lower power draw as iOS 27 emphasizes AI features, with a fall release anticipated.
A new report claims Google's Pixel 11 lineup will use a Tensor G6 built on TSMC’s 2nm process, making it the first smartphone with this node ahead of rivals. The Pixel 11 Pro Fold is also said to switch to MediaTek’s M90 modem, enabling up to 12Gbps 5G speeds, satellite connectivity, and dual active 5G SIMs, with Google officially unveiling the Pixel 11 family on August 12.
A leaked Qualcomm roadmap hints at a broader flagship strategy, adding Snapdragon 8 Gen 5 Pro (SM8845 Pro) and an 8 Elite Gen 5XX Edition alongside upcoming 8 Elite Gen 6 standard and Pro variants on a 2nm process, with older Gen 5 silicon likely sticking around. The expanded, multi‑tier lineup could make choosing a future Android flagship more confusing for buyers.
Bloomberg reports Apple plans a base 14-inch MacBook Pro this year powered by a standalone M6 chip built on a 2-nm process (TSMC’s N2) with higher memory bandwidth (~200 GB/s), an updated Neural Engine, and AI-optimized GPU, while M6 Pro/Max are not in this generation and higher-end chips are saved for the M7 in 2027. Some entry-level Macs may also get the M6, but Bloomberg says the Mac mini and iMac will likely stick with M5 chips for now; the MacBook Air was updated in March 2026 and may not receive a new chip until 2027.
Qualcomm’s standard Snapdragon 8 Elite Gen 6 is expected to reuse the 126.2 mm² die size of Gen 5 to curb costs, but a switch to TSMC’s 2nm process is anticipated to push prices higher for device makers. The Pro version, meanwhile, is rumored to gain a larger L2 cache and a wider GPU bus, further differentiating the lineup amid Qualcomm’s ongoing handset-market challenges.
Rumors say the iPhone 18 Pro lineup will bring six upgrades: a smaller Dynamic Island and a unified back with new colors; a new A20 Pro chip built on a 2nm process with WMCM packaging; a variable-aperture main camera and an improved telephoto; longer battery life driven by the 2nm chip and an Apple-designed C2 5G modem; an updated Camera Control 2.0; and the switch to a C2 modem, with a foldable iPhone Ultra also anticipated in the lineup.
Bloomberg reports Apple is ramping up the 20th‑anniversary iPhone in two sizes (likely about 6.3 and 6.9 inches) to launch with a second‑generation foldable iPhone, all using a 2‑nanometer A21 chip. The iPhone 18 Pro/Pro Max are expected this year with A20, the standard iPhone 18 arrives in spring 2027, and an iPhone 19 with a distinct A21 chip is also in development.
Leak-filled preview outlines nine upgrades for the iPhone 18: a 2nm A20 chip, 12GB RAM, in-house C2 modem, brighter adaptive display, smaller Dynamic Island, upgraded cameras (24MP front, improved rear sensors, potential 3x lossless zoom), redesigned camera control button, and shared components with the iPhone 18e. Pro models are expected in late 2026, with the standard iPhone 18 arriving in early 2027, signaling a staggered release strategy and stronger ecosystem control.
A Pixel 12 leak claims Google will power the lineup with the Tensor G7 on a 2nm process (codenamed La Jolla), continuing Google's in-house chip strategy for AI features and camera processing. While this keeps AI-first advantages, benchmarks described in the leak suggest Tensor-based Pixel devices still trail latest Snapdragon and Apple chips, fueling ongoing debate about whether Google will eventually switch to Snapdragon/MediaTek while maintaining Tensor's software benefits.
Rumors claim the iPhone 18 base model will ship with 12GB RAM (up from 8GB), matching Pro models to support Apple Intelligence on iOS 27, powered by TSMC’s 2nm A20 chip with about a 15% performance gain and improved efficiency. A split release is suggested: iPhone 18 Pro and a foldable variant in fall 2026, with the standard iPhone 18, 18e, and Air 2 arriving in early 2027.
Bloomberg’s Mark Gurman reports Apple plans a major redesign of the high-end MacBook line by early 2027, potentially branding the top model as 'MacBook Ultra' with an OLED touchscreen, a Dynamic Island-style camera hole, M6 Pro/Max chips on TSMC’s 2nm process, a thinner chassis, and built-in cellular connectivity; RAM supply constraints and timing could push the launch from late 2026 to early 2027, with the entry-level 14-inch Pro using M6 likely receiving fewer changes.
Meta Platforms and Broadcom announced a multi‑gigawatt deal to design and deploy Meta’s MTIA AI accelerators, starting with 1 gigawatt of Training and Inference Accelerators and scaling to multiple gigawatts by 2027–2029, built on a 2‑nanometer process. Simultaneously, Broadcom CEO Hock Tan will not stand for reelection to Meta's board after two years of service. The internally used MTIA chips reflect the broader shift by hyperscalers toward custom silicon to power AI data centers.