Qualcomm's 2nm Snapdragon 8 Elite Extreme Gen 6 Prototype Emerges With New 2+3+3 CPU, Heat Pass Packaging
A Chinese content creator leaked an engineering prototype of Qualcomm's upcoming Snapdragon 8 Elite Extreme Gen 6, showing a new 2+3+3 CPU cluster with high clocks on a 2nm N2P process and an updated Heat Pass Block heatsink packaging; Geekbench 6 scores are 4,327 (single-core) and 12,873 (multi-core), with Apple's A20 Pro still ahead in single-core, suggesting potentially better sustained performance once commercial units ship as more details surface at the Snapdragon Summit.