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2nm

All articles tagged with #2nm

Qualcomm's 2nm Snapdragon 8 Elite Extreme Gen 6 Prototype Emerges With New 2+3+3 CPU, Heat Pass Packaging
technology18 days ago

Qualcomm's 2nm Snapdragon 8 Elite Extreme Gen 6 Prototype Emerges With New 2+3+3 CPU, Heat Pass Packaging

A Chinese content creator leaked an engineering prototype of Qualcomm's upcoming Snapdragon 8 Elite Extreme Gen 6, showing a new 2+3+3 CPU cluster with high clocks on a 2nm N2P process and an updated Heat Pass Block heatsink packaging; Geekbench 6 scores are 4,327 (single-core) and 12,873 (multi-core), with Apple's A20 Pro still ahead in single-core, suggesting potentially better sustained performance once commercial units ship as more details surface at the Snapdragon Summit.

Apple’s A20 Pro arrives on a 2nm process with notable CPU, GPU and AI gains
technology1 month ago

Apple’s A20 Pro arrives on a 2nm process with notable CPU, GPU and AI gains

Apple unveiled the A20 Pro, its first 2nm chip powering the iPhone Duo, iPhone 18 Pro, and iPhone 18 Pro Max. The six‑core CPU includes two high‑performance cores, a seven‑core GPU with up to 40% more performance, upgraded neural accelerators with 2x faster 8‑bit math, and a 32‑core Neural Engine, all supported by a 50% increase in memory bandwidth. A new packaging design separates memory from the SoC for better thermal performance, plus a dual‑display capable display engine for the iPhone Duo and refined pixel handling around the under‑display camera.

Apple's A20 Pro Debuts as 2nm Powerhouse in iPhone 18 Pro
technology1 month ago

Apple's A20 Pro Debuts as 2nm Powerhouse in iPhone 18 Pro

Apple unveils the A20 Pro chip in the iPhone 18 Pro lineup, the first smartphone chip built on a 2nm process, featuring a 6-core CPU with two desktop-class performance cores up to 20% faster, a redesigned 7-core GPU with up to 40% faster graphics, and a 32-core Neural Engine with enhanced FP8 on-device AI; it also uses a new silicon packaging for improved thermal management and the widest memory interface yet, delivering up to 40% more sustained performance than the A19 Pro and twice the sustained performance of the A18 Pro.

Apple A20 Pro Advances to 7-Core GPU With Wider Memory Bus via WMCM Packaging
technology1 month ago

Apple A20 Pro Advances to 7-Core GPU With Wider Memory Bus via WMCM Packaging

Apple’s A20 Pro front-side die shot suggests a 7-core GPU and a wider 96-bit LPDDR5X memory bus made possible by WMCM packaging, with memory dies placed beside the SoC; CPU core count remains two performance and four efficiency cores, and L2 caches are 16MB per performance core and up to 8MB for efficiency cores. Energy efficiency details and Neural Engine information await benchmarks ahead of Apple’s September 9 reveal for the 2nm iPhone 18 Pro lineup.

AMD Unveils EPYC Venice: Zen 6 on 2nm with up to 256 Cores and 5GHz+
technology2 months ago

AMD Unveils EPYC Venice: Zen 6 on 2nm with up to 256 Cores and 5GHz+

AMD has launched the EPYC Venice family, a Zen 6-based HPC CPU lineup built on TSMC’s 2nm process, offering up to 256 cores, 203 billion transistors and up to 5 GHz clocks. AMD claims Venice delivers major performance and efficiency gains over prior generations and NVIDIA’s Vera, including up to 2.8x agents-per-watt in agent-sandbox workloads and up to 3.3x per-watt in general-purpose servers, across SP7 and SP8 variants designed for AI-host and HPC deployments.

AMD Unveils Zen 6 Venice EPYC: 256‑Core HPC Power on 2nm
technology2 months ago

AMD Unveils Zen 6 Venice EPYC: 256‑Core HPC Power on 2nm

AMD teased its 6th‑gen EPYC Venice CPUs based on Zen 6, led by a 256‑core flagship built for HPC and AI workloads. The chip combines eight CCDs with two large IO dies, and uses TSMC’s 2nm process to enable PCIe 6.0, UCIe, and DDR5 support, delivering AMD’s claimed ~70% gains in performance and efficiency and a 30%+ increase in thread density. Positioned for Helios AI racks to handle agentic AI workloads, Venice faces competition from Nvidia’s Vera systems as CPUs become more central to data‑center AI workflows.

AI demand fuels TSMC to another quarterly profit high
business8 months ago

AI demand fuels TSMC to another quarterly profit high

TSMC posted a 35% year‑over‑year rise in Q4 profit to NT$505.74 billion on revenue of NT$1.046 trillion ($33.7B), beating estimates as AI‑server chip demand remains strong. Chips 7nm or smaller made up 77% of wafer revenue, with a ramp to 2nm on the way. For 2026, capex is guided to $52–$56 billion (vs. $40.9B in 2025) as AI demand and advanced process technology drive growth.

Sony's Next-Gen PlayStation Devices: Handheld and Console Specs Revealed
technology1 year ago

Sony's Next-Gen PlayStation Devices: Handheld and Console Specs Revealed

Sony's upcoming handheld console, codenamed 'Jupiter', is expected to launch in 2028 and will feature a 2nm chip developed by AMD and fabricated using Samsung's SF2P process, aiming for improved performance and power efficiency. The project is still under review, with mass production not expected before 2028, as Sony looks to re-enter the handheld gaming market amidst competition from Nintendo and Microsoft.

"2025 Production Target Set for Next-Gen Apple Chip Technology"
technology2 years ago

"2025 Production Target Set for Next-Gen Apple Chip Technology"

Next-generation 2nm chip technology for future Apple devices is set to begin production in 2025, with TSMC installing equipment for 2nm chip production as early as April. Apple is expected to utilize these chips soon after their production begins, following their use of TSMC's initial 3nm technology in the iPhone 15 Pro and ‌iPhone 15 Pro‌ Max. TSMC is also evaluating the production of even more advanced 1.4nm chips in 2027, while mass production of enhanced ‌3nm‌ nodes is set to appear in Apple devices later this year.