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Thermal Design

All articles tagged with #thermal design

Apple’s A20 Pro and Hinge Graphite Pipe Solve iPhone Duo Thermal Challenges
technology1 day ago

Apple’s A20 Pro and Hinge Graphite Pipe Solve iPhone Duo Thermal Challenges

Apple’s new A20 Pro chip, built on a 2nm process, powers the iPhone 18 Pro, 18 Pro Max, and the first foldable iPhone Duo. To manage heat in these slim devices, Apple replaced the traditional vertical chip stack with a wafer-level multichip module, placing DRAM beside the processor. This change, inspired by Mac laptop designs, improves data speeds and cooling. The iPhone Duo features a unique thermal solution: a flexible graphite pipe routed through the hinge to transfer heat between the two halves, ensuring consistent performance despite the device doubling in thickness when closed. Apple claims these innovations yield 35% higher sustained GPU performance than the previous generation.

"iPhone 15 Pro's Thermal Design Compromises Lead to Overheating Reports"
technology3 years ago

"iPhone 15 Pro's Thermal Design Compromises Lead to Overheating Reports"

Reports of overheating issues with Apple's iPhone 15 Pro are likely due to compromises made in the phone's thermal system design to achieve a lighter weight, according to analyst Ming-Chi Kuo. The reduced heat dissipation area and the use of a titanium body instead of stainless steel are cited as design compromises. It is unclear how widespread the issue is and if Apple will address it, but software updates may be a potential solution. The iPhone 15 Pro has also faced criticism for its build quality, including shattered back glass and software glitches.