All articles tagged with #wmcm packaging
High‑resolution images of the iPhone 18 Pro logic board show the A20 Pro occupying a larger die area inside WMCM packaging, with hints of a 2nm process and a bigger Neural Engine, plus potential LPDDR6 RAM paired to Qualcomm’s Snapdragon X80 modem; Apple’s official specs remain unconfirmed ahead of the September keynote.
A packaging layout leak for Apple’s A20 Pro suggests the iPhone 18 Pro lineup will gain a 96-bit memory interface (up from 64), potentially 12 GB of RAM with LPDDR6 or LPDDR5X, and a wafer‑level multi‑chip packaging design that places memory dies in the same package to improve thermals. The chip is also expected to sport a larger NPU and CPU/GPU improvements on TSMC’s N2 process.
Analysts expect Apple to launch a foldable iPhone together with the iPhone 18 Pro/Max this September, all powered by the A20 Pro chip built on TSMC’s 2nm N2 process with WMCM RAM integration for faster, more efficient performance. The lineup is rumored to include 12GB RAM, 48MP rear cameras, and a C2 modem, with the foldable reportedly featuring a 7.8-inch inner display and 5.5-inch outer display, crease-free engineering, and Touch ID. iPhone 18 and 18e are anticipated to debut in spring 2027 under a split-launch strategy.