
SemiAnalysis Teardown Shows Intel 18A Matches TSMC N3E but Lags in Density
SemiAnalysis’s teardown of Intel’s Panther Lake processor confirms the first commercial use of the 18A process, featuring RibbonFET transistors and PowerVia backside power delivery. While 18A achieves logic density comparable to TSMC’s N3E, it does not surpass TSMC’s newer N2 or Samsung’s SF2 nodes. The chip uses a multi-tile design, with compute on 18A but graphics and I/O on TSMC nodes, highlighting a mixed manufacturing strategy.

