Tag

Advanced Packaging

All articles tagged with #advanced packaging

markets11 days ago•123 min saved

AI's Hidden Winners: OSATs, Photonics, and Cooling Gear Up the Next Compute Boom

AI investment is shifting from chipmakers to the bottlenecks that scale AI systems. The next winners will be firms solving advanced packaging (OSATs like ASX and AMKR), data movement via optical interconnects (Fabrinet FN, Coherent COHR, Lumentum LITE), and liquid cooling (Vertiv VRT, Ecolab ECL) as hyperscalers spend about $2 trillion on infrastructure and GenAI revenue tops $175 billion, signaling a new compute supercycle beyond AMD, MU, and NVDA.

via Benzinga|

#advanced-packaging #ai-infrastructure #liquid-cooling

technology6 months ago•1 min saved

Intel Plans Compact Chip with 16 Compute Dies and 24 HBM5 Modules

Intel has demonstrated its advanced packaging capabilities, enabling the integration of up to 16 compute dies and 24 HBM5 memory modules in a single package using Foveros 3D and EMIB-T interconnects, leveraging its 18A and 14A process nodes, with plans for high-power GPU designs and competitive positioning against TSMC.

via TechPowerUp|

#advanced-packaging #foveros-3d #hbm5

technology2 years ago•3 min saved

TSMC Explores Advanced Chip Packaging Expansion in Japan

Taiwan's TSMC is considering building advanced chip packaging capacity in Japan, potentially bringing its CoWoS technology to the country, as part of Japan's efforts to revitalize its semiconductor industry. TSMC's plans in Japan include building a plant and establishing a research and development center, with the company partnering with Japanese firms like Sony and Toyota. The move comes amid a global surge in demand for advanced semiconductor packaging, driven by the artificial intelligence boom, and reflects Japan's aim to play a larger role in advanced packaging.

via Yahoo Finance|

#advanced-packaging #chipmaking #japan

technology2 years ago•3 min saved

TSMC Explores Advanced Chip Packaging Expansion in Japan

Taiwan Semiconductor Manufacturing Company (TSMC) is reportedly considering building advanced chip packaging capacity in Japan, potentially bringing its chip on wafer on substrate (CoWoS) technology to the country. This move would add momentum to Japan's efforts to revitalize its semiconductor industry, with TSMC already having established operations and partnerships in Japan. The demand for advanced semiconductor packaging has surged globally, and TSMC's potential expansion into Japan aligns with the industry trend.

via Reuters|

#advanced-packaging #chipmakers #japan

technology2 years ago•12 min saved

"Intel's Foundry Business: Advancements in Chip Manufacturing and Process Roadmap"

Intel Foundry, formerly known as Intel Foundry Services, is expanding its foundry business with the addition of the 14A process to its roadmap, marking the first extension in over two years. The company is aiming to become a one-stop shop for chip production, offering not only wafer lithography but also advanced packaging, chip assembly, and testing services. Intel is on track to deliver on its promise of 5 nodes in 4 years, with products based on its first EUV-based node, Intel 4, already available in the market. The company is also focusing on collaborating with Electronic Design Automation (EDA) providers and IP vendors to ensure a complete ecosystem for chip design and manufacturing.

via AnandTech|

#advanced-packaging #chip-manufacturing #euv-lithography

technology2 years ago•5 min saved

Intel's Groundbreaking Glass Substrates Revolutionize Computing Power

Intel has announced the development of industry-leading glass substrates for advanced packaging, which will enable the scaling of transistors in a package and advance Moore's Law. Glass substrates offer superior properties such as ultra-low flatness, better thermal and mechanical stability, and higher interconnect density, making them ideal for high-performance chip packages for data-intensive workloads like AI. Intel plans to deliver complete glass substrate solutions to the market in the second half of this decade, allowing the semiconductor industry to continue scaling beyond 2030.

via Investor Relations :: Intel Corporation (INTC)|

#advanced-packaging #glass-substrates #intel

technology2 years ago•8 min saved

Intel's Groundbreaking Glass Substrates Pave the Way for Future Chip Advancements

Intel has announced a breakthrough in the development of glass substrates for chip packaging, aiming to advance Moore's Law. The use of glass substrates will enable Intel to create larger chip packages, allowing for more chips to be fitted into a single electrical package. By the end of the decade, Intel foresees packaging 30 trillion transistors on a glass substrate, along with other innovations such as 3D stacking of chips. Glass substrates offer advantages such as enhanced thermal and mechanical stability, higher interconnect density, and improved power delivery, making them suitable for data-intensive applications like AI. Intel plans to introduce comprehensive glass substrate solutions to the market in the latter half of this decade, ensuring the continuation of Moore's Law beyond 2030.

via VentureBeat|

#advanced-packaging #chip-technology #glass-substrates

technology3 years ago•6 min saved

China's Tech Strategy Embraces Chiplets as Key Component

Chiplet technology, a cost-efficient way to package groups of small semiconductors, has emerged as a core part of China's tech strategy as it seeks to achieve self-reliance in semiconductor manufacturing. With the US restricting China's access to advanced machines and materials for chip production, chiplets have become even more important. Chinese authorities have highlighted chiplets in policy documents, and companies like Huawei have actively filed chiplet patents. China's chip packaging industry holds an advantage in chiplet technology, but experts note that the proportion of advanced packaging is still relatively small. Nevertheless, China is rapidly exploiting chiplet technology in various applications, from artificial intelligence to self-driving cars, and major investments in the area are expected.

via Reuters|

#advanced-packaging #china #chiplets

technology3 years ago•7 min saved

"U.S. Prioritizes 'Chiplets' for Tech Advancement"

Chiplets, a way to design chips for higher performance, has become an essential tool for progress in semiconductors. The United States accounts for only 3% of chip packaging, which is overwhelmingly dominated by companies in Asia. The CHIPS Act, a $52 billion subsidy package, aims to reinvigorate domestic chip making by providing money to build more sophisticated factories called “fabs” and stoking advanced packaging factories in the United States to capture more of that essential process. Assembling all the elements required to reduce U.S. dependence on Asian companies is a huge challenge.

via The New York Times|

#advanced-packaging #chiplets #chips-act