AMD's Zen 7 Grimlock Targets 1.4nm TSMC Process and Next-Gen Packaging for 2028 Launch
Rumors say AMD's Zen 7 'Grimlock' CPUs will be built on TSMC's 1.4nm A14 process and use Powertech's FOPLP packaging, featuring a new CCD with up to 16 cores and 224 MB L3 via 3D V-Cache, targeting a 2028 launch and stronger data-center AI performance amid intense CPU competition.