All articles tagged with #jedec
Samsung Electronics announced the industry’s fastest UFS 5.0 storage solution, delivering up to 10.8 GB/s sequential read and 9.5 GB/s write, with more than 40% power efficiency gains versus UFS 4.1, in a compact 7.5 × 13 × 0.9 mm package (16.7% smaller). Mass production starts in Q4 in capacities up to 1 TB, enabling faster on-device AI for next-gen mobile, wearables and XR devices.
UFS 5.0, nearing completion and expected to deliver up to 10.8GB/s bandwidth, will significantly boost performance and reduce power consumption in future smartphones and other devices, with commercial availability anticipated around 2027.
JEDEC is developing DDR6 RAM, which could double the data rate of the fastest DDR5 modules, potentially reaching up to 21,000 MT/s. DDR6 will feature dual 12-bit data channels and is expected to debut in the second half of 2025, promising significant performance boosts for both desktop and portable systems.
JEDEC has published the JESD318: Compression Attached Memory Module (CAMM2) standard, which aims to replace the traditional SO-DIMM memory module. CAMM2, originally introduced by Dell, offers thinner designs and faster speeds than SO-DIMM. The standard includes DDR5 and LPDDR5/5X designs, with capacities ranging from 8GB to 128GB on a single module. CAMM2 modules provide the potential for thinner computer designs and dual-channel memory configurations, offering more bandwidth. While it may take years for CAMM2 to overtake SO-DIMM, the standardization is expected to drive adoption and make the modules more affordable in the future.
The JEDEC organization has finalized the specifications for CAMM2, a potential successor to SO-DIMMs, which allows laptop manufacturers to offer a more compact alternative to soldered RAM. CAMM2 modules can accommodate up to 128 GB of memory and are thinner than two stacked SO-DIMMs. They support both DDR5 and LPDDR5X RAM, with the latter previously only available as soldered memory. Dell has already started offering CAMM modules in selected mobile workstations, and other manufacturers are expected to follow suit next year.
JEDEC has officially published the CAMM2 memory module standard, which offers higher capacities, faster speeds, and space savings. CAMM2 is a slim memory standard designed for laptops and portable platforms, providing maximum performance and easy field-repairability. It offers advantages over traditional SO-DIMM modules, including a slimmer design and faster communication between RAM and the CPU. CAMM2 comes in DDR5 and LPDDR5/5X versions, catering to different use cases. Samsung and Micron have announced plans to offer CAMM2 modules with capacities up to 128 GB and speeds up to 8533 MT/s. However, one drawback is that upgrading or swapping out CAMM2 modules may require replacing the entire module.