
Qualcomm Allegedly Imitates Samsung’s HPB Heat Tech in Gen 6 Pro, but Execution Falls Short
Rumors say Qualcomm copied Samsung Exynos 2600’s copper Heat Path Block (HPB) thermal tech for the Snapdragon 8 Elite Gen 6 Pro in the Galaxy S27 lineup, but the implementation reportedly isn’t as effective as Samsung’s. The report notes Qualcomm will offer two chip variants (not six), with non-binned versions potentially costing upwards of $300, and only premium devices like the Galaxy S27 Ultra likely to carry the standard Gen 6 Pro.






