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Teardown

All articles tagged with #teardown

iFixit Teardown Reveals Repair Risks and Modem Discrepancies in iPhone 18 Pro
technology1 month ago

iFixit Teardown Reveals Repair Risks and Modem Discrepancies in iPhone 18 Pro

iFixit’s teardown of the iPhone 18 Pro highlights a fragile plastic display frame and complex variable aperture mechanism, resulting in a provisional repairability score of 7/10. While the device features a larger vapor chamber and under-display Face ID, component-level repairs remain difficult. Additionally, TechInsights confirmed that the US iPhone 18 Pro Max uses a Qualcomm modem instead of Apple’s C2 chip, a deviation from Apple’s marketing claims.

via 9to5Mac|
#apple#ifixit#iphone-18-pro
Inside the 2026 Amazon Fire Stick HD: Hardware Looks Like a 4K Model, But Software Keeps It HD
technology2 months ago

Inside the 2026 Amazon Fire Stick HD: Hardware Looks Like a 4K Model, But Software Keeps It HD

A teardown of the 2026 Fire Stick HD shows it uses a Mediatek MT8698D SoC with a G310V2 GPU and VPU similar to 4K models, suggesting the HD/4K distinction is software-based. The device includes NAND flash, MT7902 wireless, and a PMIC with USB-PD, and features interesting ceramic patch antennas for Bluetooth/Wi‑Fi. While the layout is conventional, the article notes the potential to upgrade via software or Android on the 8 GB eMMC to enable higher resolutions.

via Hackaday|
#amazon#fire-stick#hardware
Roku Remotes’ Purple Tag: Branding Marker You Can Remove (With Caution)
technology3 months ago

Roku Remotes’ Purple Tag: Branding Marker You Can Remove (With Caution)

Roku uses a distinctive purple fabric tag on its remotes as a branding and origin indicator, a design the USPTO recognized in 2015. The tag isn’t functional but helps identify genuine remotes; it can be removed, though doing so may require disassembly and could damage the device or void the warranty. If removal seems risky, replacement remotes are available.

via bgr.com|
#branding#remote#roku
Teardown of a 10G SFP+ Module Reveals Heat, Chips, and a Hidden Compatibility MCU
technology4 months ago

Teardown of a 10G SFP+ Module Reveals Heat, Chips, and a Hidden Compatibility MCU

A teardown of 10Gbit SFP+ adapters shows they run hot (idle around 40°C) and can dissipate up to about 2.5W. The module houses a Marvell Alaska X 88X3310/40P PHY with a metal heatsink attached to the enclosure and an 8051-based MCU that flags the module as a 30 m multimode fiber type for compatibility. Newer Wiitek-branded modules use a newer chipset and run cooler. The takeaway is to ensure adequate airflow or use the appropriate fiber type to avoid heat-induced frame drops; older modules may discolor and stress thermally, suggesting single-mode fiber as a cooler, practical alternative.

via Hackaday|
#10g#power#sfp
Trump Mobile's T1 Unmasked as HTC U24 Pro Clone, Teardown Confirms
technology4 months ago

Trump Mobile's T1 Unmasked as HTC U24 Pro Clone, Teardown Confirms

iFixit’s teardown shows Trump Mobile’s T1 is effectively a rebranded HTC U24 Pro, with only cosmetic changes to differentiate it; the two share the same 6.8-inch display and mainboard, and even the same camera layout, with the T1 swapping in a different memory package and a larger 19.35Wh battery but a slower 30W charger versus the U24 Pro’s 17.23Wh battery and 60W charger. Pricing places the T1 at $499 as an “introductory” tag while the U24 Pro commonly sells around $470–$557, suggesting reduced hardware costs and a branding stance that may be more marketing than reality than patriotic claims.

via Wccftech|
#htc-u24-pro#ifixit#smartphones
Inside LEGO’s 2026 Smart Brick: a sealed, sensor-packed power brick
technology7 months ago

Inside LEGO’s 2026 Smart Brick: a sealed, sensor-packed power brick

A teardown of LEGO’s 2026 Smart Brick reveals a tightly sealed 2×4 brick packed with NFC, Bluetooth, LEDs, a microphone, and what appears to be a custom ASIC. The device houses an EM Microelectronics EM9305 BLE SoC and a 16 Mb SPI flash, with the main ASIC (DA000001-04) remaining enigmatic due to flip-chip packaging. Access requires destructive opening, and the built-in Li‑ion battery raises repairability/regulation questions in light of EU rules. Firmware analysis and open-source tooling are already advancing the reverse‑engineering effort.

via Hackaday|
#asic#em9305#lego
AirTag 2 Die-Shot Teardown Reveals Its Silicon Story
technology8 months ago

AirTag 2 Die-Shot Teardown Reveals Its Silicon Story

Hackaday walks through a die-shot teardown of the Apple AirTag 2, exposing the device’s silicon stack: a Nordic nRF52840 Bluetooth SoC, a large UWB chip assembly with a visible die for precise localization via an antenna network and time-of-flight, plus a Bosch accelerometer and an SPI memory. The article explains how the UWB system uses multiple antennas for localization and notes that the speaker, tucked deep inside, can be disabled non-destructively, though the process is non-trivial.

via Hackaday|
#airtag-2#apple#die-shots
Sony Releases Updated PS5 Pro and DualSense V3 with Subtle Improvements
technology1 year ago

Sony Releases Updated PS5 Pro and DualSense V3 with Subtle Improvements

The new PlayStation 5 Pro CFI-7121 model offers improved power efficiency (2-3%), runs cooler, and is quieter than the original, with minor hardware changes like a lighter heatsink and different fan. The DualSense controller saw minimal updates, mainly removing the back microphone to reduce costs. Overall, these small upgrades enhance performance without significant changes or cost increases.

via Wccftech|
#gaming-console#hardware-upgrade#playstation-5-pro