
iPhone 18 Pro to feature 2nm A20 Pro and WMCM packaging
Rumor has it Apple’s iPhone 18 Pro and Ultra will ship with the A20 Pro chip built on TSMC’s 2-nanometer process, delivering more power and efficiency. A second upgrade comes via Wafer-Level Multi-Chip Module packaging, bringing memory closer to the SoC for better AI performance and lower power draw as iOS 27 emphasizes AI features, with a fall release anticipated.










