All articles tagged with #heat management
DJI's Osmo Pocket 4 is set to launch globally on April 16, 2026 with a rumored 1-inch sensor and 4K/240fps slow-motion, plus reframing across formats for mobile-first content; however, heat management and higher processing/storage demands may limit sustained high-frame-rate performance in the Pocket form factor.
Researchers at the DIII-D National Fusion Facility have demonstrated that an inverted 'D' shaped plasma, known as negative triangularity, can achieve stable, high-performance conditions for nuclear fusion, potentially addressing heat management and stability challenges in future fusion reactors.
Scientists at EPFL have developed the X-point target radiator, a new magnetic control method that prevents overheating in fusion reactors, making fusion power more reliable and practical, with potential commercial deployment by the 2030s.
Google's upcoming Tensor G4 chip is expected to adopt a new packaging method from Samsung, potentially leading to improved power efficiency and heat management. The chip will utilize Samsung's latest 4nm process and a newer Fan-out Wafer Level Packaging (FOWLP) method, building on the success of Tensor G3. This move is seen as a minor upgrade over the existing G3 chip, with Google reportedly planning to transition to TSMC for the release of Tensor G5 in 2025's Pixel 10 series. Tensor G4 is anticipated to be used in the Pixel 9 series and Pixel Fold 2.
Teardowns of the unofficially named "Slim" version of the PlayStation 5 reveal that while it is smaller and lighter, it doesn't offer significant improvements in efficiency compared to previous slim models. The new console features a detachable disc drive, allowing for potential repairability, but it requires online pairing with Sony's servers. The design changes include a different finish, repositioned ports, and clear plastic feet. The internal components, including the chip, heat management, and power supply, remain largely the same as the original PS5.