All articles tagged with #liquid metal
Apple is reportedly moving away from aluminum on the iPhone 17 Pro due to denting, weighing a return to titanium with improved heat management or a costly liquid-metal option, with titanium seen as the most likely path if a lighter, better-thermally-conductive version can be perfected.
Trial production of Apple’s first foldable iPhone, reportedly dubbed the iPhone Ultra, has slowed due to hinge reliability issues under repeated opening/closing. Leakers say Apple plans to use Liquid Metal hinge components and is pushing crease-management tech to keep the display crease-free long term. Production is reportedly one to two months behind schedule, with mass production expected to begin in July 2026 and a fall launch at the September event still on track, though customer availability could slip into December.
Researchers overturn decades of assumptions about liquid gallium, showing covalent bonds vanish at its melting point and reappear as temperature rises, helping explain non-linear changes in conductivity; a follow-up study reveals the surface is not completely disordered but forms subtle, three-layer order that persists across several angstroms and is strengthened by an oxide layer, though a single bismuth impurity can disrupt it, with significant implications for liquid-metal technologies.
Scientists used transmission electron microscopy to watch molten platinum nanoparticles on graphene and found that some atoms remain pinned at defect sites, forming an atomic corral that traps liquid metal and alters solidification. When only a few atoms are fixed, crystallization proceeds normally; with many pinned atoms, the liquid can remain unfrozen well below its normal freezing point and turn into an amorphous metal instead of a crystal. This corralled, hybrid state could impact catalyst design and materials science, and researchers aim to learn to place pinned atoms more precisely to build larger corrals.
A rumor suggests Apple’s iPhone Fold will use a liquid metal hinge and titanium body to improve durability and weight distribution, featuring a crease-minimizing OLED display with a ~7.7-inch main panel and ~5.4-inch cover. Sources like Yeux1122 and Ming-Chi Kuo are cited, though mass production of liquid metal has historically been challenging. If true, the device could launch in H2 2026 as an eSIM-only model with a around $2,399 price.
Apple reportedly plans a foldable iPhone with a liquid-metal hinge and a revised titanium body to boost strength while reducing weight, targeting a fall 2026 debut alongside the iPhone 18 Pro models and featuring a book-style fold with a large inner display and compact outer panel.
ASUS reportedly updated the liquid metal and thermal paste application on the ROG Matrix RTX 5090 Limited Edition to address a cooling-related issue, with overclocker Der8auer observing a new, more controlled layout that keeps liquid metal on the IHS while using thermal paste barriers. Early testing indicates the revised card runs cooler under heavy load (roughly 70–72°C) at higher power draw, suggesting a modest thermal improvement over earlier samples.
Sony has addressed the liquid metal leakage issue in certain PS5 models by adopting a new heatsink design from the PS5 Pro, which prevents spillage and improves cooling, extending the console's lifespan. The update is available for specific models like CFI-2100, CFI-2200, and CFI-2116 B01Y, while older models may still experience issues.
Researchers at Seoul National University have developed a flexible, bandage-like wearable device that uses liquid metal circuits and a novel laser sintering process to enable real-time, continuous blood pressure monitoring, offering a more comfortable and accurate alternative to traditional cuff-based methods, with potential applications in healthcare, fitness, and daily health management.
Scientists have developed a new type of self-healing, reconfigurable circuit board using vitrimer and liquid metal droplets, which can withstand damage, be reshaped with heat, and are recyclable, offering a sustainable alternative to traditional, non-recyclable circuit boards and addressing the growing issue of electronic waste.
The PS5 is experiencing overheating issues due to a design flaw involving liquid metal cooling, especially in launch models and when placed vertically, which can lead to hardware failure over time. Sony attempted to address this by adding ridges to the heatsink to improve liquid metal distribution, but users are advised to keep their consoles horizontal to mitigate the risk.
Researchers at the Helmholtz-Zentrum Dresden-Rossendorf have successfully visualized a detailed three-dimensional image of turbulent temperature-driven liquid metal flow using a self-developed method called contactless inductive flow tomography (CIFT). This breakthrough could provide insights into geophysical and astrophysical flow phenomena and industrial applications, such as the casting of liquid steel. The team overcame challenges in measuring the small flow-induced magnetic fields and aims to further develop the measurement method for increased accuracy and deeper insights into turbulent liquid metal flows.
Hardware expert Der8auer delidded the AMD Ryzen 7 8700G APU, revealing its die and achieving a significant temperature reduction of up to 25 degrees by applying liquid metal. The delidding process involved using a delidding tool from Thermal Grizzly, and despite the APU's lower die height, thermal performance improved with the use of graphene thermal pads and liquid metal. While delidding may not have widespread market potential, it proved beneficial for reducing thermals and increasing clock speeds in constrained cooling setups.
Overclockers have successfully boosted the AMD Ryzen 7 8700G APU's RDNA3 graphics to 3.3 GHz, achieving stable performance with a voltage of 1.25. Additionally, using liquid metal instead of thermal compound has significantly reduced temperatures, with results showing a decrease from 85°C to just above 60°C during 5.0 GHz overclocking across all cores. The APU offers substantial overclocking potential, particularly for graphics, and replacing the conductive material underneath the integrated heatspreader can greatly enhance cooling efficiency and performance.
Scientists have developed a liquid metal coating treatment called GaLM, which shows promise as an antimicrobial agent. GaLM particles have improved biocompatibility and low cytotoxicity, making them suitable for use in bandages, medical devices, and drug nanoparticles. The liquid state of GaLM allows for easy combination with other components, creating more efficient antimicrobial metals. GaLMs can be activated by external stimuli and offer potential as the next generation of antimicrobial and anti-inflammatory agents. This research is part of a global effort to combat antimicrobial resistance.