Tag

Thermal Management

All articles tagged with #thermal management

Fanless but Fierce: Why the MacBook Air Stays Cool Without a Fan
technology8 days ago

Fanless but Fierce: Why the MacBook Air Stays Cool Without a Fan

Apple’s fanless MacBook Air stays cool using a thick aluminum heat spreader and the metal chassis to passively dissipate heat from the M-series chip, delivering near‑Pro performance for most tasks; sustained heavy workloads will throttle as cooling becomes less efficient. Benchmarks show the M5 Air approaching the base M5 Pro in single-core, multi-core, and GPU tests, though the Pro can still pull ahead in long, demanding sessions. The design traces back to the M1 era, with iFixit noting the removal of a fan, and reviewers acknowledging cooling tweaks exist but don’t remove throttling under peak load.

Qualcomm Allegedly Imitates Samsung’s HPB Heat Tech in Gen 6 Pro, but Execution Falls Short
technology25 days ago

Qualcomm Allegedly Imitates Samsung’s HPB Heat Tech in Gen 6 Pro, but Execution Falls Short

Rumors say Qualcomm copied Samsung Exynos 2600’s copper Heat Path Block (HPB) thermal tech for the Snapdragon 8 Elite Gen 6 Pro in the Galaxy S27 lineup, but the implementation reportedly isn’t as effective as Samsung’s. The report notes Qualcomm will offer two chip variants (not six), with non-binned versions potentially costing upwards of $300, and only premium devices like the Galaxy S27 Ultra likely to carry the standard Gen 6 Pro.

Apple's iPhone Ultra Hinge Acts as a Heatsink with Liquidmetal Build
technology1 month ago

Apple's iPhone Ultra Hinge Acts as a Heatsink with Liquidmetal Build

Rumors claim the iPhone Ultra foldable will use a vacuum/ vapor chamber cooling system and a heat‑transfer hinge that doubles as a heatsink, with the hinge made from Liquidmetal for added strength. Apple allegedly designs a dedicated heat path to compensate Liquidmetal’s relatively poor thermal conductivity, though the device's IP68 status remains unconfirmed.

Pixel 6 Pro Reboots Linked to False Tensor TMU Thermal Trip
technology1 month ago

Pixel 6 Pro Reboots Linked to False Tensor TMU Thermal Trip

Reddit reports that the Pixel 6 Pro can reboot on Android 16 due to a false thermal-management unit (TMU) trip in Google’s Tensor GS101, even when the device isn’t hot (temperatures around 56–57°C vs. a 115°C threshold). The boot reason often shows reboot,thermal,tj, and users are advised to pull bug reports to confirm the issue. Google Support says random reboots aren’t a known issue, and it isn’t yet clear whether other Pixel models are affected; affected users should file a bug report to help develop a patch.

Exynos 2600's Heat Pass Block Outperforms LN-Cooled Snapdragon, Signals Practical Future Cooling
technology1 month ago

Exynos 2600's Heat Pass Block Outperforms LN-Cooled Snapdragon, Signals Practical Future Cooling

Samsung’s Exynos 2600 introduces Heat Pass Block copper heatsink tech to improve heat transfer, and tests suggest it outperforms a liquid‑nitrogen–cooled Snapdragon 8 Elite Gen 5. While HPB enables better sustained performance and can be aided by a small clip‑on fan for long gaming sessions, the Exynos 2600 still throttles. The development hints that future SoCs may widely adopt advanced cooling like SBS for CPU/DRAM, with Exynos 2700 reportedly exploring such architectures.

Solid-State EV Batteries: Cost, Heat, and Dendrite Dilemmas
technology4 months ago

Solid-State EV Batteries: Cost, Heat, and Dendrite Dilemmas

Solid-state batteries swap a liquid electrolyte for a solid one in EV cells, promising safety and higher energy density but face major hurdles before mass production: higher overall lithium demand and costs, risk of dendrite-caused short circuits and thermal runaway (with even non‑lithium options like sodium-ion as alternatives), stringent manufacturing tolerances and interfacial resistance at the cathode–electrolyte–anode interfaces, brittle ceramic separators prone to cracking, and thermal-management challenges since solid electrolytes don’t dissipate heat as easily as liquids.

Qualcomm Targets Thermal Fix for Snapdragon 8 Gen 6 with Copper HPB Heatsink
technology5 months ago

Qualcomm Targets Thermal Fix for Snapdragon 8 Gen 6 with Copper HPB Heatsink

Rumors say Qualcomm will use Heat Pass Block copper heatsinks on the Snapdragon 8 Elite Gen 6 Pro and Gen 6 to curb temperatures as clocks rise toward 5 GHz, with TSMC’s 2nm process expected to help but not fully solve cooling in smartphones; testing reportedly shows 5.00 GHz potential in ideal conditions, making an advanced cooling solution like HPB seem necessary—though no official confirmation has emerged.

Improve Xbox/ROG Ally Performance by Disabling CPU Boost
technology6 months ago

Improve Xbox/ROG Ally Performance by Disabling CPU Boost

Disabling CPU Boost on handheld gaming PCs like Xbox Ally and ASUS ROG Ally can improve game performance, reduce heat, and extend battery life by preventing thermal throttling and inconsistent frame rates, especially in GPU-heavy titles. The process is simple through Armoury Crate SE, allowing users to toggle between raw speed and cooler, smoother gameplay based on their needs.

iPhone 17 Pro and Pro Max: A Hardware-Focused Success
technology9 months ago

iPhone 17 Pro and Pro Max: A Hardware-Focused Success

The iPhone 17 Pro and Pro Max have shown significant improvements in battery life, thermal management, and camera quality after a week of use, with durable Ceramic Shield 2 and minimal scratches, though store displays may cause material transfer marks. The devices also feature a new vapor chamber cooling system and an improved front camera, making them a compelling upgrade for users.